Display device

ABSTRACT

A thin and lightweight display device is disclosed. An organic light-emitting display device having a touch sensor is configured such that an outer planarization layer fills a space between a plurality of dams, thereby preventing a short circuit between routing lines in the space between the dams, and such that touch electrodes are disposed on an encapsulation structure for encapsulating a light-emitting element, with the result that an additional bonding process is not required, whereby the process is simplified and cost is reduced.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of Korean Patent Application No.10-2017-0067449, filed May 31, 2017, which is hereby incorporated byreference as if fully set forth herein.

BACKGROUND Technical Field

The present disclosure relates to a display device, and moreparticularly to a display device manufactured through a simplifiedprocess at reduced cost.

Description of the Related Art

A touchscreen is an input device that allows a user to input a commandby selecting one of multiple instructions displayed on a screen, such asthat of a display device, using a user's hand or an object. That is, thetouchscreen converts the contact position, at which the user's hand orthe object directly contacts the touchscreen, into an electrical signalto receive the instruction selected at the contact position as an inputsignal. The touchscreen has been increasingly used, since thetouchscreen is capable of replacing an additional input device that isconnected to the display device for operation, such as a keyboard or amouse.

In most cases, the touchscreen is generally attached to the front of adisplay panel, such as a liquid crystal display panel or an organiclight-emitting display panel, using an adhesive. Since the touchscreenis separately manufactured and is attached to the front of the displaypanel, the process is complicated and cost is increased due to theaddition of an attaching step.

BRIEF SUMMARY

Accordingly, the present disclosure is directed to a display device thatsubstantially obviates one or more problems due to limitations anddisadvantages of the related art.

An object of the present disclosure is to provide a display devicemanufactured through a simplified process at reduced cost.

Additional advantages, objects, and features of the disclosure will beset forth in part in the description which follows and in part willbecome apparent to those having ordinary skill in the art uponexamination of the following or may be learned from practice of thedisclosure. The objectives and other advantages of the disclosure may berealized and attained by the structure particularly pointed out in thewritten description and claims hereof as well as the appended drawings.

To achieve these objects and other advantages and in accordance with thepurpose of the disclosure, as embodied and broadly described herein, anorganic light-emitting display device having a touch sensor isconfigured such that an outer planarization layer fills a space betweena plurality of dams, thereby preventing a short circuit between routinglines in the space between the dams, and such that touch electrodes aredisposed on an encapsulation structure for encapsulating alight-emitting element, with the result that an additional bondingprocess is not required, whereby the process is simplified and cost isreduced.

It is to be understood that both the foregoing general description andthe following detailed description of the present disclosure areexemplary and explanatory and are intended to provide furtherexplanation of the disclosure as claimed.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosure and are incorporated in and constitute apart of this application, illustrate embodiment(s) of the disclosure andtogether with the description serve to explain the principle of thedisclosure. In the drawings:

FIG. 1 is a perspective view showing an organic light-emitting displaydevice having a touch sensor according to a first embodiment of thepresent disclosure;

FIG. 2 is a plan view of the organic light-emitting display devicehaving the touch sensor shown in FIG. 1;

FIG. 3 is a sectional view of the organic light-emitting display devicehaving the touch sensor taken along lines I-I′ and II-II′ of FIG. 1;

FIGS. 4A to 4F are plan and sectional views illustrating a manufacturingmethod according to a comparative example that does not have an outerplanarization layer shown in FIG. 3;

FIGS. 5A to 5F are plan and sectional views illustrating a manufacturingmethod according to the embodiment that has the outer planarizationlayer shown in FIG. 3;

FIG. 6 is a sectional view showing an organic light-emitting displaydevice having a touch sensor according to a second embodiment of thepresent disclosure;

FIG. 7 is a sectional view showing another embodiment of a display padshown in FIG. 6;

FIGS. 8A to 8D are sectional views illustrating a method ofmanufacturing the organic light-emitting display device having the touchsensor shown in FIG. 6;

FIG. 9 is a sectional view showing an organic light-emitting displaydevice having a touch sensor according to a third embodiment of thepresent disclosure;

FIGS. 10A and 10B are a plan view and a sectional view showing anotherembodiment of first and second touch electrodes and a second bridgeshown in FIG. 3; and

FIG. 11 is a sectional view showing an organic light-emitting displaydevice having a touch sensor and a touch buffer film according to afourth embodiment of the present disclosure.

DETAILED DESCRIPTION

Reference will now be made in detail to the preferred embodiments of thepresent disclosure, examples of which are illustrated in theaccompanying drawings. Wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.

FIG. 1 is a perspective view showing an organic light-emitting displaydevice having a touch sensor according to the present disclosure.

The organic light-emitting display device having the touch sensor shownin FIG. 1 detects variation in a mutual capacitance Cm (the touchsensor) due to a user's touch through touch electrodes 152 e and 154 eshown in FIG. 2 during a touch period to sense whether a touch has beenperformed and the touched position. The organic light-emitting displaydevice having the touch sensor shown in FIG. 1 displays an image throughrespective unit pixels each including a light-emitting element 120. Eachunit pixel includes red (R), green (G), and blue (B) sub-pixels PXL.Alternatively, each unit pixel may include red (R), green (G), blue (B),and white (W) sub-pixels PXL.

To this end, the organic light-emitting display device shown in FIG. 1includes a plurality of sub-pixels PXL arranged on a substrate 111 in amatrix fashion, an encapsulation structure 140 disposed on thesub-pixels PXL, and a mutual capacitance Cm disposed on theencapsulation structure 140.

Each of the sub-pixels PXL includes a pixel-driving circuit and alight-emitting element 120 connected to the pixel-driving circuit.

The pixel-driving circuit includes a switching transistor T1, a drivingtransistor T2, and a storage capacitor Cst. Meanwhile, in the presentdisclosure, the pixel-driving circuit has been described as includingtwo transistors T and one capacitor C by way of example. However, thepresent disclosure is not limited thereto. That is, a 3T1C or 3T2C typepixel-driving circuit having three or more transistors T and one or morecapacitors C may be used.

When a scan pulse is supplied to a scan line SL, the switchingtransistor T1 is turned on to supply a data signal, which is supplied toa data line DL, to the storage capacitor Cst and to a gate electrode ofthe driving transistor T2.

In response to the data signal supplied to the gate electrode of thedriving transistor T2, the driving transistor T2 controls current I thatis supplied from a high-voltage (VDD) supply line to the light-emittingelement 120 to adjust the amount of light emitted by the light-emittingelement 120. Even when the switching transistor T1 is turned off, thedriving transistor T2 supplies uniform current to the light-emittingelement 120 using voltage charged in the storage capacitor Cst such thatthe light-emitting element 120 keeps emitting light until a data signalof the next frame is supplied.

As shown in FIG. 3, the driving transistor 130 (T2) includes asemiconductor layer 134 disposed on a buffer layer 112, a gate electrode132 overlapping the semiconductor layer 134 in the state in which a gateinsulating film 102 is disposed therebetween, and source and drainelectrodes 136 and 138 formed on an interlayer insulating film 114 so asto contact the semiconductor layer 134. The semiconductor layer 134 isformed of at least one of an amorphous semiconductor material, apolycrystalline semiconductor material, and an oxide semiconductormaterial.

The light-emitting element 120 includes an anode electrode 122, alight-emitting stack 124 formed on the anode electrode 122, and acathode electrode 126 formed on the light-emitting stack 124.

The anode electrode 122 is electrically connected to a drain electrode138 of the driving transistor 130 (T2), which is exposed through a pixelcontact hole formed through a passivation film 116 and a pixelplanarization layer 118.

At least one light-emitting stack 124 is formed on the anode electrode122 in a light-emitting area defined by a bank 128. The light-emittingstack 124 is formed by stacking a hole-related layer, an organiclight-emitting layer, and an electron-related layer on the anodeelectrode 122 in the forward order or in the reverse order. Thelight-emitting stack 124 may include first and second light-emittingstacks that are opposite each other in the state in which a chargegeneration layer is disposed therebetween. In this case, the organiclight-emitting layer of one of the first and second light-emittingstacks generates blue light, and the organic light-emitting layer of theother of the first and second light-emitting stacks generatesyellowish-green light. Consequently, white light is generated by thefirst and second light-emitting stacks. The white light generated by thelight-emitting stack 124 is incident on a color filter, which is locatedabove or under the light-emitting stack 124, to realize a color image.Alternatively, each light-emitting stack 124 may generate colored lightcorresponding to each sub-pixel without an additional color filter inorder to realize a color image. That is, the light-emitting stack 124 ofthe red (R) sub-pixel may generate red light, the light-emitting stack124 of the green (G) sub-pixel may generate green light, and thelight-emitting stack 124 of the blue (B) sub-pixel may generate bluelight.

The cathode electrode 126 is formed so as to be opposite the anodeelectrode 122 in the state in which the light-emitting stack 124 isdisposed therebetween, and is connected to a low-voltage (VSS) supplyline.

The encapsulation structure 140 prevents external moisture or oxygenfrom permeating into the light-emitting element 120, which has lowresistance to moisture or oxygen. To this end, the encapsulationstructure 140 includes a plurality of inorganic encapsulation layers 142and 146 and an organic encapsulation layer 144 disposed between theinorganic encapsulation layers 142 and 146. The inorganic encapsulationlayer 146 is disposed at the uppermost layer. The encapsulationstructure 140 includes at least two inorganic encapsulation layers 142and 146 and at least one organic encapsulation layer 144. In the presentdisclosure, an encapsulation structure 140 having a structure in whichan organic encapsulation layer 144 is disposed between first and secondinorganic encapsulation layers 142 and 146 will be described by way ofexample.

The first inorganic encapsulation layer 142 is formed on a substrate101, on which the cathode electrode 126 is formed, so as to be closestto the light-emitting element 120. The first inorganic encapsulationlayer 142 is formed of an inorganic insulating material that can bedeposited at a low temperature, such as silicon nitride (SiN_(x)),silicon oxide (SiO_(x)), silicon oxide nitride (SiON), or aluminum oxide(Al₂O₃). Consequently, the first inorganic encapsulation layer 142 isdeposited in a low-temperature atmosphere, whereby it is possible toprevent damage to the light-emitting stack 124, which has low resistanceto a high-temperature atmosphere, when the first inorganic encapsulationlayer 142 is deposited.

The organic encapsulation layer 144 reduces stress that might occurbetween the layers due to bending of the organic light-emitting deviceand improves planarization. The organic encapsulation layer 144 isformed of an organic insulating material, such as acrylic resin, epoxyresin, polyimide, polyethylene, or silicon oxycarbide (SiOC).

In the case in which the organic encapsulation layer 144 is formed usingan inkjet method, a dam 106 is disposed in order to prevent the organicencapsulation layer 144, which is in a liquid state, from spreading tothe edge of the substrate 111. The dam 106 is disposed so as to becloser to the edge of the substrate 111 than the organic encapsulationlayer 144. The organic encapsulation layer 144 is prevented fromspreading to a pad area, which is located at the outermost region of thesubstrate 111 and in which a touch pad 170 and a display pad 180 aredisposed, by the provision of the dam 106. To this end, as shown in FIG.2, the dam may be formed so as to completely surround an active area, inwhich the light-emitting element 120 is disposed, or may be formed onlybetween the active area and the pad area. In the case in which the padarea, in which the touch pad 170 and the display pad 180 are disposed,is located only at one side of the substrate 111, the dam 106 is alsodisposed only at one side of the substrate 111. In the case in which thepad area, in which the touch pad 170 and the display pad 180 aredisposed, is located at each side of the substrate 111, the dam 106 isalso disposed at each side of the substrate 111. At this time, the dams106, which are spaced apart from each other by a predetermined distance,may be disposed side by side. Meanwhile, in the present disclosure, asshown in FIGS. 2 and 3, the dam 106 has been described as including aclosed type first dam 106 a for surrounding the active area and a seconddam 106 b disposed between the first dam 106 a and the pad area by wayof example. However, the present disclosure is not limited thereto.

Each of the first and second dams 106 a and 106 b is formed so as tohave a single-layer structure or a multi-layer structure. For example,each of the first and second dams 106 a and 106 b is formed of the samematerial at the same time as at least one of the bank 128 and a spacer(not shown), whereby it is possible to prevent the addition of a maskprocess and an increase in cost.

The second inorganic encapsulation layer 146 is formed on the substrate111, on which the organic encapsulation layer 144 is formed, so as tocover the upper surfaces and the side surfaces of the organicencapsulation layer 144 and the first inorganic encapsulation layer 142.Consequently, the second inorganic encapsulation layer 146 minimizes orprevents external moisture or oxygen from permeating into the firstinorganic encapsulation layer 142 and the organic encapsulation layer144. The second inorganic encapsulation layer 146 is formed of aninorganic insulating material, such as silicon nitride (SiN_(x)),silicon oxide (SiO_(x)), silicon oxide nitride (SiON), or aluminum oxide(Al₂O₃).

A touch-sensing line 154 and a touch-driving line 152 are disposed onthe encapsulation structure 140 so as to intersect or otherwise overlapeach other in the state in which a touch insulating film 156 is disposedtherebetween, whereby a mutual capacitance Cm is formed at theintersection of the touch-sensing line 154 and the touch-driving line152. Consequently, the mutual capacitance Cm charges an electric chargeby a touch-driving pulse supplied to the touch-driving line 152 anddischarges the charged electric charge to the touch-sensing line 154,thereby serving as a touch sensor. The term intersect is used herein inthe broadest sense to include lines that overlap or overlie each otherwith one or more layers in between and is not limited to the meaning ofthe two line contact each other, merge or become combined.

The touch-driving line 152 includes a plurality of first touchelectrodes 152 e and first bridges 152 b for electricallyinterconnecting the first touch electrodes 152 e.

The first touch electrodes 152 e are spaced apart from each other on thetouch insulating film 156 by a predetermined distance in an X direction,which is a first direction. Each of the first touch electrodes 152 e iselectrically connected to an adjacent first touch electrode 152 e via acorresponding one of the first bridges 152 b.

The first bridges 152 b are formed on the second inorganic encapsulationlayer 146, and are exposed via touch contact holes 150, which are formedthrough the touch insulating film 156, so as to be electricallyconnected to the first touch electrode 152 e. The first bridges 152 bare disposed so as to overlap the bank 128, whereby it is possible toprevent the reduction of an aperture ratio due to the first bridges 152b.

The touch-sensing line 154 includes a plurality of second touchelectrodes 154 e and second bridges 154 b for electricallyinterconnecting the second touch electrodes 154 e.

The second touch electrodes 154 e are spaced apart from each other onthe touch insulating film 156 by a predetermined distance in a Ydirection, which is a second direction. Each of the second touchelectrodes 154 e is electrically connected to an adjacent second touchelectrode 154 e via a corresponding one of the second bridges 154 b.

The second bridges 154 b are disposed on the touch insulating film 156,which is disposed in the same plane as the second touch electrodes 154e, so as to be electrically connected to the second touch electrodes 154e without additional contact holes. In the same manner as the firstbridges 152 b, the second bridges 154 b are disposed so as to overlapthe bank 128, whereby it is possible to prevent the reduction of anaperture ratio due to the second bridges 154 b.

The touch-driving line 152 and the touch-sensing line 154 of the presentdisclosure are connected to a touch-driving unit (not shown) via arouting line 160 and the touch pad 170, respectively.

The touch pad 170 is connected to a signal transfer film (not shown), onwhich the touch-driving unit is mounted. The touch pad 170 is disposedon at least one of the buffer layer 112, the interlayer insulating film114, and the passivation film 116, which is disposed between thesubstrate 111 and the encapsulation structure 140, in the state of beingin contact therewith. For example, a structure in which the touch pad170 is disposed on the interlayer insulating film 114 so as to contactthe interlayer insulating film 114 will be described by way of example.The touch pad 170 includes a touch pad lower electrode 172 and a touchpad upper electrode 174.

The touch pad lower electrode 172 is formed of the same material and isdisposed in the same plane as at least one of the gate electrode 132 orthe source and drain electrodes 136 and 138 of the driving transistor130 (T2) so as to have a single-layer or multi-layer structure. Forexample, the touch pad lower electrode 172 is formed of the samematerial as the source and drain electrodes 136 and 138, and is disposedon the interlayer insulating film 114. Consequently, the lower surfaceof the touch pad lower electrode 172 contacts the interlayer insulatingfilm 114.

The touch pad upper electrode 174 is electrically connected to the touchpad lower electrode 172, which is exposed through a touch pad contacthole 176 formed through the passivation film 116 and the touchinsulating film 156. The touch pad upper electrode 174 is formed of thesame material as the routing line 160, and is formed using the same maskprocess as the routing line 160. Since the touch pad upper electrode 174extends from the routing line 160, the touch pad upper electrode 174 iselectrically connected to the routing line 160 not via an additionalcontact hole.

Meanwhile, the display pad 180 is also disposed in a non-active (bezel)area, in which the touch pad 170 is disposed. For example, as shown inFIG. 2, display pads 180 may be disposed between touch pads 170, ortouch pads 170 may be disposed between display pads 180. In addition,the touch pad 1709 may be disposed at one side of the display panel, andthe display pad 180 may be disposed at the other side of the displaypanel. Meanwhile, the disposition of the touch pad 170 and the displaypad 180 is not limited to the structure shown in FIG. 2. The dispositionof the touch pad 170 and the display pad 180 may be variously changeddepending on the design of the display device.

The display pad 180 is formed so as to have a stacked structuredifferent from the stacked structure of the touch pad 170.Alternatively, as shown in FIG. 3, the display pad 180 is formed so asto have the same stacked structure as the touch pad 170.

The display pad 180 shown in FIG. 3 includes a display pad lowerelectrode 182 and a display pad upper electrode 184.

The display pad lower electrode 182 is formed so as to be connected toat least one of the scan line SL, the data line DL, the low-voltage(VSS) supply line, and the high-voltage (VDD) supply line in the activearea, in which the light-emitting element 120 is formed. The display padlower electrode 182 is formed of the same material and is disposed inthe same plane as at least one of the gate electrode 132 and the sourceand drain electrodes 136 and 138 of the driving transistor 130 (T2) soas to have a single-layer or multi-layer structure. For example, thedisplay pad lower electrode 182 is formed of the same material as thesource and drain electrodes 136 and 138, and is disposed on theinterlayer insulating film 114, in the same manner as the touch padlower electrode 172.

The display pad upper electrode 184 is electrically connected to thedisplay pad lower electrode 182, which is exposed through a display padcontact hole 186 formed through the passivation film 116 and the touchinsulating film 156. The display pad upper electrode 184 is formed ofthe same material as the routing line 160, and is formed using the samemask process as the routing line 160.

The routing line 160 transmits a touch-driving pulse generated by thetouch-driving unit to the touch-driving line 152 via the touch pad 170,and transmits a touch signal from the touch-sensing line 154 to thetouch-driving unit via the touch pad 170. Consequently, the routing line160 is formed between the first touch electrodes 152 e and the touch pad170 and between the second touch electrodes 154 e and the touch pad 170to electrically connect the first and second touch electrodes 152 e and154 e to the touch pad 170. Here, as shown in FIG. 2, the routing line160 extends from the first touch electrodes 152 e to at least one of theleft side and the right side of the active area AA so as to be connectedto the touch pad 170. In addition, the routing line 160 extends from thesecond touch electrodes 154 e to at least one of the upper side and thelower side of the active area AA so as to be connected to the touch pad170. The disposition of the routing line 160 may be variously changeddepending on the design of the display device.

The routing line 160 is disposed above the dam 106 so as to intersectthe first and second dams 106 a and 106 b. Between the first and seconddams 106 a and 106 b, an outer planarization layer 158 is disposed atthe outer region of the substrate 111, which does not overlap thelight-emitting element 120, so as to fill the space between the firstand second dams 106 a and 106 b. In this case, the routing line 160 isdisposed so as to cover the side surface of the organic encapsulationlayer 144 and the upper surface of the outer planarization layer 158.The routing line 160, disposed so as to cover the upper surface of theouter planarization layer 158, is disposed higher than the upper surfaceof the pixel planarization layer 118. The outer planarization layer 158is formed of an organic insulating material having a high planarizationfunction, such as an acrylic-based organic insulating material, anepoxy-based organic insulating material, or a siloxane-based organicinsulating material.

The outer planarization layer 158, formed of an organic insulatingmaterial having a high planarization function, is formed between thedams 106 a and 106 b so as to have a thickness similar to the thicknessof the dams 106 a and 106 b. In this case, the upper surface of theouter planarization layer 158 is disposed in the same plane as the uppersurface of the second inorganic encapsulation layer 146, which isdisposed so as to cover the dams 106 a and 106 b, is disposed in thesame plane as the upper surface of each of the dams 106 a and 106 b, oris disposed between the upper surface of the second inorganicencapsulation layer 146 and the upper surface of the dams 106 a and 106b. Consequently, a step formed by the height of the dams 106 a and 106 bis planarized by the outer planarization layer 158, whereby the routingline 160, disposed above the outer planarization layer 158 and the dams106 a and 106 b, is formed flat without any substantial step. As aresult, the breakage or short-circuit of the routing line 160 crossingthe dam 160 may be prevented.

Hereinafter, a routing line manufacturing method according to acomparative example that does not have the outer planarization layer 158will be described with reference to FIGS. 4A to 4F, and a routing linemanufacturing method according to the embodiment that has the outerplanarization layer 158 will be described with reference to FIGS. 5A to5F.

FIG. 4A is a plan view of one comparative example and FIG. 4B issectional view along line III-III′ of FIG. 4A. In the comparativeexample, as shown in FIGS. 4A and 4B, a conductive layer 178 a isdeposited on the entire surface of a touch insulating film 156 so as tocover a plurality of dams 106 a and 106 b, and a photoresist 188 a iscoated on the conductive layer 178 a. At this time, the photoresist 188a is coated such that the thickness of the portion of the photoresist188 a formed between the dams 106 a and 106 b is greater than thethickness of the portion of the photoresist 188 a formed above the dams106 a and 106 b, since the photoresist 188 a is a liquid-phase organicinsulating material. At this time, if the amount of light exposure isset based on the thickness of the portion of the photoresist 188 aformed above the dams 106 a and 106 b, the thick portion of thephotoresist 188 a formed between the dams 106 a and 106 b is notproperly exposed to light. As a result, a residual photoresist film 188c remains after a development process, as shown in FIG. 4C. FIG. 4C issectional view along line III-III′ of FIG. 4C. If the conductive layer178 a is etched using a photoresist pattern 188 b having the residualphotoresist film 188 c, as shown in FIG. 4E, the conductive layer 178 aremains on a region corresponding to the residual photoresist film 188c, whereby a short circuit occurs between adjacent routing lines 160.FIG. 4F is sectional view along line III-III′ of FIG. 4E.

On the other hand, in the embodiment in which the outer planarizationlayer 158 is provided between the dams 106 a and 106 b, as shown in FIG.5A, a conductive layer 178 a is deposited on the entire surface of asubstrate 111, on which an outer planarization layer 158 is formed, anda photoresist 188 a is coated on the conductive layer 178 a. FIG. 5A isa plan view of one comparative example and FIG. 5B is sectional viewalong line III-II′ of FIG. 5A. At this time, in the embodiment in whichthe outer planarization layer 158 is provided between the dams 106 a and106 b, the photoresist 188 a is formed such that the portion of thephotoresist 188 a formed above the dams 106 a and 106 b and the portionof the photoresist 188 a formed between the dams 106 a and 106 b havethe same thickness. When the photoresist 188 a is exposed to light anddeveloped, as shown in FIG. 5C, a photoresist pattern 188 b having thesame thickness above the dams 106 a and 106 b and between the dams 106 aand 106 b is formed. FIG. 5D is sectional view along line III-III′ ofFIG. 5C. The conductive layer 178 a is patterned by etching using thephotoresist pattern 188 b as a mask. As a result, routing lines 160 eachhaving a desired line width based on the design thereof are formed, asshown in FIG. 5E. In the embodiment of the present disclosure,therefore, it is possible to prevent a short circuit between adjacentrouting lines 160. FIG. 5F is sectional view along line III-III′ of FIG.5E.

In the organic light-emitting display device having the touch sensoraccording to the first embodiment of the present disclosure, the outerplanarization layer 158 is provided to fill the space between the dams106 a and 106 b. Consequently, it is possible to prevent the residualfilm of the photoresist film used to form the routing lines fromremaining in the space between the dams 106 a and 106 b, whereby it ispossible to prevent a short circuit between adjacent routing lines inthe space between the dams 106 a and 106 b. In addition, a touchscreenis attached to a conventional organic light-emitting display deviceusing an adhesive. In the organic light-emitting display deviceaccording to the present disclosure, however, the touch electrodes 152 eand 154 e are disposed on the encapsulation structure 140. Consequently,an additional bonding process is not required, whereby the process issimplified and cost is reduced.

FIG. 6 is a sectional view showing an organic light-emitting displaydevice having a touch sensor according to a second embodiment of thepresent disclosure.

The organic light-emitting display device shown in FIG. 6 is identicalin construction to the organic light-emitting display device shown inFIG. 3 except that the outer planarization layer 158 is formed to fillthe space between the organic encapsulation layer 144 and the first dam106 a as well as the space between the dams 106 a and 106 b.Consequently, a detailed description of the same components will beomitted. Both dams are adjacent to the organic encapsulation layer 144,the first dam 106 a is bordering on the organic encapsulation layer andthe second dam 106 b is spaced from the first dam a selected distanceand is near to, namely, adjacent to the organic encapsulation layer

As shown in FIG. 6, an outer planarization layer 158 is formed to fill aspace between dams 106 a and 106 b and a space between an organicencapsulation layer 144 and the first dam 106 a, which is the closest tothe organic encapsulation layer 144. At this time, the upper surface ofthe outer planarization layer 158 is disposed in the same plane as theupper surface of a second inorganic encapsulation layer 146, which isdisposed so as to cover the dams 106 a and 106 b, is disposed in thesame plane as the upper surface of each of the dams 106 a and 106 b orthe upper surface of the organic encapsulation layer 144, or is disposedbetween the upper surface of the dams 106 a and 106 b and the uppersurface of the organic encapsulation layer 144. In this case, it ispossible to prevent a residual film of a photoresist film used to form arouting line 160 from remaining in the space between the dams 106 a and106 b and in the space between the first dam 106 a and the organicencapsulation layer 144. Consequently, it is possible to prevent a shortcircuit of the routing line 160 in the space between the dams 106 a and106 b and the space between the first dam 106 a and the organicencapsulation layer 144.

The routing line 160 is disposed so as to cross the outer planarizationlayer 158, which is disposed so as to cover the first and second dams106 a and 106 b. The routing line 160 is exposed on the organicencapsulation layer 144 through a routing contact hole 162 formedthrough a touch insulating film 156 so as to be connected to first andsecond touch electrodes 152 e and 154 e.

A touch pad 170 is connected to the routing line 160 on the outerplanarization layer 158. The touch pad 170 includes a touch pad lowerelectrode 172 and a touch pad upper electrode 174.

The touch pad lower electrode 172 is formed of the same material as therouting line 160, and is formed using the same mask process as therouting line 160. Since the touch pad lower electrode 172 extends fromthe routing line 160 on the outer planarization layer 158, the touch padlower electrode 172 is electrically connected to the routing line 160not via an additional contact hole.

The touch pad upper electrode 174 is electrically connected to the touchpad lower electrode 172, which is exposed through a touch pad contacthole 176 formed through the touch insulating film 156. The touch padupper electrode 174 is formed of the same material as a second bridge154 b, and is formed using the same mask process as the second bridge154 b.

A display pad 180 is also disposed in a non-active (bezel) area, inwhich the touch pad 170 is disposed. The display pad 180 includes adisplay pad lower electrode 182 and a display pad upper electrode 184.

The display pad lower electrode 182 is formed so as to be connected toat least one of a scan line SL, a data line DL, a low-voltage (VSS)supply line, and a high-voltage (VDD) supply line in an active area, inwhich a light-emitting element 120 is formed. The display pad lowerelectrode 182 is formed of the same material and is disposed in the sameplane as at least one of a gate electrode 132 and source and drainelectrodes 136 and 138 of a driving transistor 130 (T2) so as to have asingle-layer or multi-layer structure. For example, the display padlower electrode 182 is formed of the same material as the source anddrain electrodes 136 and 138, and is disposed on an interlayerinsulating film 114.

The display pad upper electrode 184 is electrically connected to thedisplay pad lower electrode 182, which is exposed through a display padcontact hole 186 formed through a passivation film 116, the outerplanarization layer 158, and the touch insulating film 156. The displaypad upper electrode 184 is formed of the same material as the secondbridge 154 b, and is formed using the same mask process as the secondbridge 154 b.

Alternatively, as shown in FIG. 7, the display pad upper electrode 184may be directly connected to the display pad lower electrode 182 not viathe display pad contact hole 186. In this case, the display pad upperelectrode 184 is disposed so as to cover the side surface and the uppersurface of the display pad lower electrode 182. The display pad upperelectrode 184 is formed of the same material using the same mask processas any one of an anode electrode 122, a cathode electrode 126, and thesecond bridge 154 b.

FIGS. 8A to 8D are views illustrating a method of manufacturing anorganic light-emitting display device having a touch sensor according tothe present disclosure. Hereinafter, a method of manufacturing theorganic light-emitting display device shown in FIG. 6 will be describedby way of example.

Referring to FIG. 8A, an outer planarization layer 158 is formed on asubstrate 110, on which a switching transistor, a driving transistor 130(T2), a light-emitting element 120, a dam 106, and an encapsulationstructure 140 are formed.

Specifically, an organic insulating material is coated on the entiresurface of the substrate 110, on which the switching transistor, thedriving transistor 130 (T2), the light-emitting element 120, the dam106, and the encapsulation structure 140 are formed. At this time, theorganic insulating material is coated such that the portion of theorganic insulating material in a region in which no organicencapsulation layer 144 is formed is thicker than the portion of theorganic insulating material in a region in which the organicencapsulation layer 144 is formed. Subsequently, the organic insulatingmaterial is dry-etched until a second inorganic encapsulation layer 146on the organic encapsulation layer 144 is exposed, whereby an outerplanarization layer 158 is formed. As shown in FIG. 6, the outerplanarization layer 158 is disposed in the non-active area, excludingthe active area, in which the light-emitting element 120 is formed.

Meanwhile, the outer planarization layer 158 shown in FIG. 3 is formedby patterning the organic insulating material through photolithographyand etching such that the organic insulating material remains onlybetween the dams 106 a and 106 b. The outer planarization layer 158shown in FIG. 7 is formed by patterning the organic insulating materialthrough photolithography and etching such that the active area, in whichthe light-emitting element 120 is formed, and the display pad lowerelectrode 182 are exposed.

As described above, the outer planarization layer 158 shown in FIG. 3 or7 is formed by photolithography and etching using a photomask, whereasthe outer planarization layer 158 shown in FIG. 6 is formed by etchingwithout photolithography. Consequently, the display device shown in FIG.6 is manufactured through a smaller number of processes than the displaydevice shown in FIG. 3 or 7, whereby manufacturing cost is furtherreduced.

Referring to FIG. 8B, a first bridge 152 b, a touch pad lower electrode172, and a routing line 160 are formed on the substrate 111, on whichthe outer planarization layer 158 is formed.

Specifically, a first conductive layer is deposited on the substrate111, on which the outer planarization layer 158 is formed, and the firstconductive layer is patterned by photolithography and etching using aphotomask. As a result, a first bridge 152 b, a touch pad lowerelectrode 172, and a routing line 160 are formed on the substrate 111,on which the outer planarization layer 158 is formed. Here, the firstconductive layer is formed of metal, such as Al, Ti, Cu, Mo, Ta, orMoTi, so as to have a single-layer structure or a multi-layer structure.

Referring to FIG. 8C, a touch insulating film 156 having a touch contacthole 150, a routing contact hole 162, a touch pad contact hole 176, anda display pad contact hole 186 is formed on the substrate 111, on whichthe first bridge 152 b, the touch pad lower electrode 172, and therouting line 160 are formed.

Specifically, an inorganic insulating material or an organic insulatingmaterial is applied to the entire surface of the substrate 111, on whichthe first bridge 152 b, the touch pad lower electrode 172, and therouting line 160 are formed, so as to form a touch insulating film 156.Here, the touch insulating film 156 is formed of an inorganic insulatingmaterial, such as SiNx, SiON, or SiO₂, or an organic insulatingmaterial, such as photoacryl, parylene, or a siloxane-based organicinsulating material. Subsequently, the touch insulating film 156 isetched using a photoresist pattern, which is formed by photolithographyusing a photomask, as a mask, and then the outer planarization layer 158and a passivation film 116, disposed on the display pad lower electrode182, are sequentially etched. As a result, a touch contact hole 150, arouting contact hole 162, a touch pad contact hole 176, and a displaypad contact hole 186 are formed. Here, the touch contact hole 150, therouting contact hole 162, and the touch pad contact hole 176 are formedthrough the touch insulating film 156, and the display pad contact hole186 is formed through the touch insulating film 156, the outerplanarization layer 158 and the passivation film 116.

Referring to FIG. 8D, first and second touch electrodes 152 e and 154 e,a second bridge 154 b, a touch pad upper electrode 174, and a displaypad upper electrode 184 are formed on the substrate 111, on which thetouch insulating film 156, having formed therein the touch contact hole150, the routing contact hole 162, the touch pad contact hole 176, andthe display pad contact hole 186, is formed.

Specifically, a second conductive layer is deposited on the substrate111, on which the touch contact hole 150, the routing contact hole 162,the touch pad contact hole 176, and the display pad contact hole 186 areformed. Here, the second conductive layer is formed of IGZO, IZO, ITO,or ZnO. Subsequently, the second conductive layer is patterned byphotolithography and etching to form first and second touch electrodes152 e and 154 e, a second bridge 154 b, a touch pad upper electrode 174,and a display pad upper electrode 184.

FIG. 9 is a sectional view showing an organic light-emitting displaydevice having a touch sensor according to a third embodiment of thepresent disclosure.

The organic light-emitting display device shown in FIG. 9 includes thesame components as the organic light-emitting display device shown inFIG. 3, 6, or 7, but differs in that a color filter 192 is furtherprovided between the encapsulation structure 140 and the touchelectrodes 152 e and 154 e. Consequently, a detailed description of thesame components will be omitted.

The color filter 192 is formed between a touch-sensing line 154 and alight-emitting element 120 and between a touch-driving line 152 and thelight-emitting element 120. The distance between the touch-sensing line154 and the light-emitting element 120 and between the touch-drivingline 152 and the light-emitting element 120 is increased by the colorfilter 192. Consequently, it is possible to minimize the magnitude ofparasitic capacitance formed between the touch-sensing line 154 and thelight-emitting element 120 and between the touch-driving line 152 andthe light-emitting element 120, thereby preventing interaction due tocoupling between the touch-sensing line 154 and the light-emittingelement 120 and between the touch-driving line 152 and thelight-emitting element 120. In addition, the color filter 192 mayprevent a liquid chemical (e.g., a developing solution or an etchingsolution), which is used to form the touch-sensing line 154 and thetouch-driving line 152, or external moisture from permeating into alight-emitting stack 124. Consequently, the color filter 192 may preventdamage to the light-emitting stack 124, which has low resistance toliquid chemicals or to moisture. Meanwhile, as shown in FIG. 9, thetouch electrodes 152 e and 154 e have been described as being disposedon the color filter 192 by way of example. Alternatively, the colorfilter 192 may be disposed on the touch electrodes 152 e and 154 e. Inthis case, the touch electrodes 152 e and 154 e are disposed between thecolor filter 192 and the encapsulation structure 140.

A black matrix 194 is disposed between color filters 192. The blackmatrix 194 serves to divide sub-pixel areas from each other and toprevent optical interference between adjacent sub-pixels and screenbleed. The black matrix 194 may be formed of a high-resistance blackinsulating material, or may be formed by stacking at least two of red(R), green (G), and blue (B) color filters 192. In addition, a touchplanarization layer 196 is formed on the substrate 111, on which thecolor filter 192 and the black matrix 194 are formed. The substrate 111,on which the color filter 192 and the black matrix 194 are formed, isplanarized by the touch planarization layer 196.

Meanwhile, in the present disclosure, as shown in FIG. 9, a touchpassivation film 198 for exposing a display pad 180 and a touch pad 170may be further provided. The touch passivation film 198 is formed so asto cover the touch electrodes 152 e and 154 e, bridges 152 b and 154 b,and a routing line 160, thereby preventing the same from being damagedby external impact or moisture. The touch passivation film 198 is formedof an organic insulating material, such as an epoxy or acrylic material,or is configured in the form of a circular polarizer,

Although, in the present disclosure, the first and second touchelectrodes 152 e and 154 e and the first and second bridges 152 b and154 b have been described as being formed in a plate shape using atransparent conductive film by way of example, as shown in FIG. 2, thesame may be formed in a mesh shape, as shown in FIGS. 10A and 10B. Thatis, each of the first and second touch electrodes 152 e and 154 e andthe first bridge 152 b may include a transparent conductive film 151 a,such as ITO or IZO, and a mesh-shaped opaque conductive layer 151 bdisposed on or under the transparent conductive film 151 a.Alternatively, each of the first and second touch electrodes 152 e and154 e and the first bridge 152 b may include only a mesh-shaped opaqueconductive layer 151 b. At this time, the opaque conductive layer 151 bis formed of at least one of Ti, Al, Mo. MoTi, Cu, and Ta, whichexhibits higher conductivity than the transparent conductive film 151 a,so as to have at least one-layer structure. For example, each of thefirst and second touch electrodes 152 e and 154 e and the first bridge152 b is formed to have a three-layer stack structure, such as Ti/Al/Ti,MoTi/Cu/MoTi, or Ti/Al/Mo.

Consequently, the resistance and capacitance of each of the first andsecond touch electrodes 152 e and 154 e and the first bridge 152 b,including the opaque conductive layer 151 b, which exhibits higherconductivity than the transparent conductive film 151 a, are reduced,whereby an RC time constant is reduced and thus touch sensitivity isimproved. In addition, the line width of each of the first and secondtouch electrodes 152 e and 154 e and the first bridge 152 b, which areformed in the mesh shape, is very small, with the result that it ispossible to prevent the reduction of an aperture ratio and transmittancedue to the first and second touch electrodes 152 e and 154 e and thefirst bridge 152 b.

Meanwhile, the second bridge 154 b, which is disposed in a planedifferent from the plane in which the touch electrodes 152 e and 154 eare disposed and which is formed of an opaque conductive film, isprovided with a plurality of slits 153, as shown in FIGS. 10A and 10B.The area of the second bridge 154 b, which has a plurality of slits 153,may be smaller than the area of a bridge having no slits 153.Consequently, it is possible to reduce the amount of external light thatis reflected by the second bridge 154 b, thereby preventing thereduction of visibility. The second bridge 154 b, which has the slits153, overlaps a bank 128, whereby it is possible to prevent thereduction of an aperture ratio due the second bridge 154 b, which isformed of an opaque conductive film.

Furthermore, in the present disclosure, the mutual-capacitance typetouch sensor including the touch-sensing line 154 and the touch-drivingline 152, which intersect each other in the state in which the touchinsulating film 156 is disposed therebetween, has been described by wayof example. Alternatively, the present disclosure may be applied to aself-capacitance type touch sensor. Each of a plurality ofself-capacitance type touch electrodes has an electrically independentself capacitance. Consequently, the touch electrodes may be used asself-capacitance type touch sensors for detecting variation incapacitance due to a user's touch. That is, routing lines 160 connectedto the self-capacitance type touch electrodes are disposed on the outerplanarization layer 158, which fills the space between the dams 106 toplanarize the space between the dams 106. Consequently, a short circuitbetween the routing lines 160 is prevented, whereby reliability isimproved.

Meanwhile, the display device according to the present invention mayfurther include a touch buffer film 148 disposed between the secondinorganic encapsulation layer 146 and the touch sensor, as shown in FIG.11. The touch buffer film 148 is disposed on the second inorganicencapsulation layer 146 in the active area, and is disposed on thesecond inorganic encapsulation layer 146 or the outer planarizationlayer 158 in the non-active area.

The touch buffer film 148 disposed under the touch insulating film 156may extend to the pad region where the touch pad 170 is disposed. Thetouch buffer film 148 is disposed on the passivation film 116 in the padregion where the touch pad 170 and the display pad 180 are disposed. Thetouch buffer film 148 is between the passivation film 116 and the touchinsulating film 156 in the pad region where the touch pad 170 and thedisplay pad 180 are disposed.

The touch buffer film 148 is disposed along the outer planarizationlayer 158. In the case in which the touch buffer film 148 is disposed onthe second inorganic encapsulation layer 146, the routing lines 160 aredisposed along the outer planarization layer 158 on the outerplanarization layer 158. In the case in which the touch buffer film 148is disposed on the outer planarization layer 158, the routing lines 160are disposed along the touch buffer film 148 on the touch buffer film148.

Here, the touch buffer film 148 is formed of an inorganic insulatingmaterial or an organic insulating material. The inorganic insulatingmaterial may include silicon oxide, silicon nitride, and/or siliconoxynitride, and the organic insulating material may include acryl,photoacryl, parylene, or a siloxane-based organic insulating material.The touch buffer film 148 may be deposited by using various depositionmethods, such as CVD, ALD, or sputtering.

In addition, the touch buffer film 148 shown in FIG. 11 may be furtherprovided in the organic light-emitting display device according to thesecond embodiment of the present invention shown in FIG. 6.

In addition, the organic encapsulation layer 144 may be formed of a samematerial as the outer planarization layer 158. The organic encapsulationlayer 144 may be diffused between the dams 106, excluding the outermostdam 106, which is closest to the pad area. In this case, the outerplanarization layer 158 is disposed so as to cover the organicencapsulation layer 144 diffused between the dams 106. Meanwhile, anorganic dielectric film formed of an organic material may be disposedbetween the dams 106, in addition to the organic encapsulation layer144.

Furthermore, the non-active area may be used as a bendable area, whichis configured to be bent toward the rear surface of the active area. Inthis case, the non-active area, in which the touch pad 170 and thedisplay pads 180 are disposed, may be bent toward the rear surface ofthe active area. Consequently, the area ratio of the active area to theentire screen of the organic light-emitting display device is maximized,and the area ratio of the non-active area, i.e. the bezel area, to theentire screen of the organic light-emitting display device is minimized.Meanwhile, the left area, the right area, and the lower area of thedisplay device, in which the routing lines 160 are disposed, may also bebent, in addition to the upper area of the display device, in which thetouch pad 170 and the display pads 180 are disposed.

As is apparent from the above description, in the display device havingthe touch sensor according to the present disclosure, the outerplanarization layer, which fills the space between the dams to planarizethe step formed by the height of the dams, is formed in the outer regionof the substrate, which does not overlap the light-emitting element.Consequently, it is possible to prevent the residual photoresist filmfrom remaining in the space between the dams, whereby it is possible toprevent a short circuit between the routing lines in the space betweenthe dams. In addition, the touch electrodes are disposed on theencapsulation structure, with the result that an additional bondingprocess is not required, whereby the process is simplified and cost isreduced.

It will be apparent to those skilled in the art that variousmodifications and variations can be made in the present disclosurewithout departing from the spirit or scope of the disclosure. Thus, itis intended that the present disclosure covers the modifications andvariations of this disclosure provided they come within the scope of theappended claims and their equivalents.

The various embodiments described above can be combined to providefurther embodiments. All of the U.S. patents, U.S. patent applicationpublications, U.S. patent applications, foreign patents, foreign patentapplications and non-patent publications referred to in thisspecification and/or listed in the Application Data Sheet areincorporated herein by reference, in their entirety. Aspects of theembodiments can be modified, if necessary to employ concepts of thevarious patents, applications and publications to provide yet furtherembodiments.

These and other changes can be made to the embodiments in light of theabove-detailed description. In general, in the following claims, theterms used should not be construed to limit the claims to the specificembodiments disclosed in the specification and the claims, but should beconstrued to include all possible embodiments along with the full scopeof equivalents to which such claims are entitled. Accordingly, theclaims are not limited by the disclosure.

1. A display device, comprising: a substrate having an active area and anon-active area; a light-emitting element disposed on the substrate; anencapsulation structure disposed on the light-emitting element, theencapsulation structure comprising a plurality of inorganicencapsulation layers and at least one organic encapsulation layerdisposed between the inorganic encapsulation layers; a plurality oftouch sensors disposed on the encapsulation structure; at least one damarranged between the active area and the non-active area; and at leastone of first planarization layer disposed in the non-active area,wherein a side surface of the first planarization layer and a sidesurface of the encapsulation structure face each other; and wherein aninorganic layer is disposed between the side surface of the firstplanarization layer and the side surface of the encapsulation structure.2. The display device according to claim 1, wherein an upper surface ofthe first planarization layer is disposed in a same plane as an uppersurface of one of the inorganic encapsulation layers that is disposed soas to cover the dams, is disposed in a same plane as an upper surface ofeach of the dams, or is disposed between the upper surface of the one ofthe inorganic encapsulation layers and the upper surface of each of thedams.
 3. The display device according to claim 1, wherein the firstplanarization layer fills a space between the organic encapsulationlayer and the dams to planarize the space between the organicencapsulation layer and the dams.
 4. The display device according toclaim 3, wherein an upper surface of the first planarization layer isdisposed in a same plane as an upper surface of one of the inorganicencapsulation layers that is disposed so as to cover the dams, isdisposed in a same plane as an upper surface of each of the dams or anupper surface of the organic encapsulation layer, or is disposed betweenthe upper surface of each of the dams and the upper surface of theorganic encapsulation layer.
 5. The display device according to claim 1,further comprising a plurality of routing lines connected respectivelyto the touch sensors so as to intersect the dams.
 6. The display deviceaccording to claim 5, wherein the routing lines are disposed so as tocover a side surface of the organic encapsulation layer and an uppersurface of the first planarization layer.
 7. The display deviceaccording to claim 5, wherein the routing lines are disposed on thefirst planarization layer, which is disposed so as to cover a sidesurface of the organic encapsulation layer.
 8. The display deviceaccording to claim 5, further comprising a touch pad disposed on atleast one of a plurality of insulating films disposed under thelight-emitting element or on the first planarization layer, the touchpad extending from the routing lines.
 9. The display device according toclaim 8, wherein the touch pad comprises: a touch pad lower electrodedisposed on at least one of the insulating films disposed under thelight-emitting element, and a touch pad upper electrode extending fromthe routing lines so as to be connected to the touch pad lowerelectrode.
 10. The display device according to claim 9, furthercomprising: a display pad disposed on at least one of the insulatingfilms disposed under the light-emitting element, wherein the display padcomprises: a display pad lower electrode disposed on at least one of theinsulating films disposed under the light-emitting element; and adisplay pad upper electrode connected to the display pad lowerelectrode, the display pad upper electrode being formed of a samematerial as the touch pad upper electrode and being disposed in a sameplane as the touch pad upper electrode.
 11. The display device accordingto claim 8, wherein the touch pad comprises: a touch pad lower electrodedisposed on the first planarization layer and extending from the routinglines; and a touch pad upper electrode connected to the touch pad lowerelectrode.
 12. The display device according to claim 11, furthercomprising: a display pad disposed on at least one of the insulatingfilms disposed under the light-emitting element, wherein the display padcomprises: a display pad lower electrode disposed on at least one of theinsulating films disposed under the light-emitting element; and adisplay pad upper electrode connected to the display pad lowerelectrode, which is exposed through a contact hole formed through thefirst planarization layer.
 13. The display device according to claim 11,further comprising: a display pad disposed on at least one of theinsulating films disposed under the light-emitting element, wherein thedisplay pad comprises: a display pad lower electrode disposed on atleast one of the insulating films disposed under the light-emittingelement; and a display pad upper electrode disposed so as to cover aside surface and an upper surface of the display pad lower electrode.14. The display device according to claim 5, further comprising: a thinfilm transistor connected to the light-emitting element; and a secondplanarization layer disposed so as to cover the thin film transistor,wherein the routing lines are disposed on the first planarization layerin the non-active layer.
 15. The display device according to claim 14,wherein the routing lines are disposed higher than an upper surface ofthe second planarization layer.
 16. The display device according toclaim 1, further comprising a color filter disposed between theencapsulation structure and the touch sensors.
 17. The display deviceaccording to claim 1, further comprising a color filter disposed on orunder the touch sensors.
 18. The display device according to claim 1,wherein each of the touch sensors comprises a touch-sensing line and atouch-driving line disposed on the encapsulation structure so as tointersect each other, the touch-driving line comprises first touchelectrodes arranged on the encapsulation structure in a first directionand a first bridge interconnecting the first touch electrodes, and thetouch-sensing line comprises second touch electrodes arranged in asecond direction, which intersects the first direction, and a secondbridge interconnecting the second touch electrodes.
 19. The displaydevice according to claim 18, wherein at least one of the first bridgeand the second bridge is provided with at least one slit.
 20. Thedisplay device according to claim 18, wherein at least one of the firsttouch electrode, the second touch electrode, the first bridge, and thesecond bridge are formed in a mesh shape.
 21. The display deviceaccording to claim 1, wherein each of the touch sensors comprises aplurality of touch electrodes each having an electrically independentself capacitance.
 22. The display device according to claim 5, furthercomprising: a touch buffer film disposed between the encapsulationstructure and the plurality of touch sensors in the active area, whereinthe routing lines are disposed on the touch buffer film.
 23. The displaydevice according to claim 8, further comprising: a touch buffer filmdisposed on a passivation film between the substrate and the routingline in the non-active area.
 24. The display device according to claim1, wherein the organic encapsulation layer is diffused between the dams,and the first planarization layer is disposed on the organicencapsulation layer disposed between the dams.
 25. The display deviceaccording to claim 10, wherein a non-active area, in which the displaypad and the touch pad are disposed, is bent toward a rear surface of anactive area, in which the light-emitting element is disposed.
 26. Thedisplay device according to claim 10, wherein the touch pad lowerelectrode is formed of the same material as source and drain electrodesof a thin film transistor connected to the light-emitting element. 27.The display device according to claim 1, wherein at least one of theplurality of dams is disposed between the side surface of the firstplanarization layer and the side surface of the encapsulation structure.28. The display device according to claim 1, wherein the inorganic layeris at least one of the plurality of inorganic encapsulation layers.